Radioelektronikos terminų žodynas. – Vilnius : BĮ UAB „Litimo“. Kazimieras Gaivenis, Gytis Juška, Vidas Kalesinskas. 2000.
Gold-Silizium-Eutektik — aukso silicio eutektika statusas T sritis radioelektronika atitikmenys: angl. gold silicon eutectic vok. Gold Silizium Eutektik, f rus. эвтектика золота и кремния, f pranc. eutectique or silicium, m … Radioelektronikos terminų žodynas
Eutectic point — The melting point of a mixture of two or more solids (such as an alloy) depends on the relative proportions of its ingredients. A eutectic or eutectic mixture is a mixture at such proportions that the melting point is as low as possible, and that … Wikipedia
Silicon — Not to be confused with the silicon containing synthetic polymer silicone. aluminium ← silicon → phosphorus C ↑ Si ↓ Ge … Wikipedia
aukso-silicio eutektika — statusas T sritis radioelektronika atitikmenys: angl. gold silicon eutectic vok. Gold Silizium Eutektik, f rus. эвтектика золота и кремния, f pranc. eutectique or silicium, m … Radioelektronikos terminų žodynas
eutectique or-silicium — aukso silicio eutektika statusas T sritis radioelektronika atitikmenys: angl. gold silicon eutectic vok. Gold Silizium Eutektik, f rus. эвтектика золота и кремния, f pranc. eutectique or silicium, m … Radioelektronikos terminų žodynas
эвтектика золота и кремния — aukso silicio eutektika statusas T sritis radioelektronika atitikmenys: angl. gold silicon eutectic vok. Gold Silizium Eutektik, f rus. эвтектика золота и кремния, f pranc. eutectique or silicium, m … Radioelektronikos terminų žodynas
Brazing — This article is about the metal joining process. For the cooking technique, see braising. Brazing practice Brazing is a metal joining process whereby a filler metal is heated above and distributed between two or more close fitting parts by… … Wikipedia
Direct bonding — describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements.[1] These requirements are specified for the… … Wikipedia
Die attachment — is the step during the integrated circuit packaging phase of semiconductor device fabrication during which a die is mounted and fixed to the package or support structure. For high powered applications, the die is usually eutectic bonded onto the… … Wikipedia
Mg-Zn-Ca metallic glass — is a type of amorphous metal. History First produced by vapour deposition techniques, thin films of metallically bonded amorphous solids were initially characterised by X ray diffraction. Despite the significant ramifications to longstanding… … Wikipedia
